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MMICs2 Report - The Worldwide Industry & Market Opportunities to 2015 for Compound Semiconductor MMICs
Publication Date Jan 2011
Publisher Engalco
Product Type Report
Pages N/A
Single User License $ 2995.00
 

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The Worldwide Industry & Market Opportunities to 2015 for Compound Semiconductor MMICs (in all compound semiconductors materials including SiGe)

This report is an update following the authors first report on the (compound semiconductor) MMICs industry which was released in summer 2008

A full summary is provided including key aspects identified, important trends observed and main global market forecast data provided including the appropriate charts and critiques. 

Section 1 - Types of End-User Systems 

Details concerning a range of the types of end-user systems into which MMIC-based sub-systems and modules are implemented. Known contracts and future developments are included. Includes examples of full systems (block diagrams) – that are either currently in production or advanced development. 

Section 2 - MMIC Materials, Processes and Types of Products 

Realization of MMICs in GaAs, GaN, InP, InGaP, SiC and SiGe. Transistor processes (e.g. pHEMT, HBT, MESFET, etc.). MMIC LNAs, LNBs, Mixers, Switches, PAs, Transmitters (Tx), receivers (Rx) and 
Transmit-Receive blocks (TxRx). Critique on the competitive impact of CMOS. . 

Section 3 - Some Product Specifications and Applications 

Typical specifications and applications for a range of types of MMICs. Applications and end-users include commercial and military. 

Section 4 - Current and On-Coming Underlying Technologies 

Material (wafer) supply. Advances in compound semiconductor materials and processing. 

Section 5 - Industry Structure, Supply Chains and Dynamics 

The players — discussions and critique. Pure-play and fabless players. Profiles on a selection of key players. Examples and roles of distributors. Speculated industry trends — 2009 onwards.

Section 6 - Shipments, Unit Prices and Monetary Sales Forecasts 2009 – 2015 

This is the prime focus of the report and it is divided into four sections, the first covers global data and issues whilst the final three are geographically orientated, as follows: Europe; North America; Rest of the World (RoW). This chapter contains extensive quantitative Engalco-originated monetary market data in both tabular (extensive tables) and chart formats (a substantial number of figures/charts). The hard data covers all the product categories by semiconductor type, i.e. GaAs, GaN, InP, SiC & SiGe. The strategies and methodologies used are described in depth for each end-user category: Cell Phones (i.e. mobile phones) Defense (AESAs, EW – receivers & jammers) ICC (Intelligent Cruise Control for road vehicles) ISM (Industrial, Scientific & Medical) Microwave Radios Millimeter-wave Radios SATCOM (mainly Ka-band – broadband – TxRx) VSATs (ground terminals) Mobile WiMAX 

Deep and detailed critiques provide underlying information and explanations of various features and market trends. End-user application segmentation is included and additional charts show this for each semiconductor for the base year (2009) and each year up to 2015. Engalco's background concerning both European and North American microwave market studies is heavily leveraged — particularly recent market-oriented private client projects.

Executive Summary 
ES.1 Introduction 
ES.2 Product Categories, Application Segments & Frequency Bands 
ES.3 “Pure-play” and Fabless Players 
ES.4 Prices, Shipments and Markets 

Section 1 Types of End-User Systems 
Introduction 
1.1 Cell Phones 
1.2 Generic RF/microwave/millimetre-wave transceiver block 
1.3 Defense Applications: AESAs 
1.4 Defense Applications: EW 
1.5 Defense Applications: Dedicated Defense Communications (“DDC”) 
1.5.1 Software-defined Radios (SDRs) 
1.5.2 UAV Communications 
1.6 Road vehicles – Intelligent Cruise Control (ICC) 
1.7 Industrial, Scientific and Medical (ISM) 
1.8 Microwave radio 
1.9 Millimeter-wave radio 
1.10 Ka-band (broadband) SATCOM 
1.11 VSATs 
1.12 SATNAV 
1.13 WiMAX (mobiles)

Section 2 MMIC Materials, Processes and Types of Products 
2.1 Introduction – RF functional blocks 
2.2 Summary of what we Mean by the Acronym “MMICs” 
2.3 Semiconductor materials (crystals and wafers) 
2.3.1 GaAs 
2.3.2 GaN (gallium nitride) 
2.3.3 Indium-gallium-phosphide (InGaP) 
2.3.4 InP (indium phosphide) 
2.3.5 InN (indium nitride) 
2.3.6 SiC (silicon carbide) 
2.3.7 SiGe (silicon germanium) 
2.4 Transistors Implemented within the Processes for MMICs 
2.4.1 Summary 
2.4.2 BiCMOS (SiGe) 
2.4.3 GaAs FETs (strictly GaAs MESFETs) 
2.4.4 HFETs 
2.4.5 GaN FETs (strictly GaN MESFETs) 
2.4.6 HBTs 
2.4.7 HEMTs 
2.4.8 pHEMTs 

Section 3 Some Product Specifications and Applications 
3.1 Anadigics 
3.2 Avago Technologies 
3.2.1 GPS front-end module (ALM-1712)
3.2.2 Millimeter-wave PA
3.3 Cree 
3.4 Endwave 
3.5 Hittite Microwave 
3.5.1 Wideband downconverter 
3.5.2 Velocium amplifier MMIC 
3.6 Microwave Technology (MwT) 
3.6.1 Low-noise wideband amplifier 
3.6.2 Broadband gain block 
3.7 Mimix Broadband 
3.7.1 Balanced power amplifier 
3.7.2 Microwave switch 
3.8 NXP Semiconductors 
3.8.1 SiGe:C Low Noise Amplifier MMIC for GPS (BGU7005) 
3.8.2 SiGe:C Wideband low-noise amplifier MMIC 
3.9 RF Micro Devices (RFMD) 
3.9.1 Integrated Synthesizer and Mixer (RF205 series) 
3.9.2 Medium power amplifier 
3.10 Sumitomo Electric Device Innovations (SEDI) 
3.10.1 Ku-band Power Amplifier MMIC (EMM5075X) 
3.10.2 Ka-band Power Amplifier MMIC (EMM5804YD) 
3.11 TriQuint Semiconductor 
3.11.1 High power DC to 18 GHz SPDT FET-based Switch (TGS2306) 
3.11.2 X-band 16-W Power Amplifier

Section 4 Current and On-Coming Underlying Technologies 
4.1 Relevant semiconductor materials – strategic aspects 
4.2 Wafer processing 
4.2.1 Deposition, patterning and etching 
4.2.2 More details on lithography 
4.2.2.1 Contact lithography 
4.2.2.2 Projection lithography 
4.2.2.3 Electron-beam lithography 
4.2.2.4 Mesa etch – or isolation implant 
4.2.2.5 Some further significant steps 
4.2.2.6 Testing 
4.2.2.7 Backside processing 
4.2.2.8 Visual inspection procedures 
4.3 Packaging 
4.3.1 Packaging for MMIC shipment 
4.3.2 Packaging MMICs into carriers to form modules 
4.4 Summary of Selected Probing Equipment and Packaging OEMs 

Section 5 Industry Structure and Dynamics 
5.1 Details of the Players and Types of Products Designed/Manufactured 
5.2 Leading Corporations 
5.3 Sales and Distribution Networks 
5.4 Brief Profiles of Some Selected Players 
5.4.1 Hittite Microwave 
5.4.2 “M/A-COM” 
Cobham plc 
M/A-COM Technology Solutions
5.4.3 Raytheon RF Components 
5.4.4 RF Micro Devices (RFMD) 
5.4.5 TriQuint Semiconductor 

Section 6 Shipments, Unit Prices and Sales Forecasts 2009 – 2015 
6.1 Strategies and Methodologies 
6.1.1 General Aspects 
6.1.2 Average Selling Prices (ASP US$) 
6.1.3 Cell Phones (mobiles) 
6.1.4 Defense 
6.1.4.1 AESAs 
6.1.4.2 EW receivers and Jammers: 
6.1.4.3 DDC Dedicated Defense Communications 
(– Engalco abbreviation) 
6.1.4.4 UAV Communications 
6.1.4.5 Millimeter-Wave Seekers 
6.1.5 ICC (Intelligent Cruise Control) 
6.1.6 ISM (Industrial, Scientific & Medical) 
6.1.7 Microwave (MW Radio) 
6.1.8 “Millimeter Wave” (MMW Radio) 
6.1.9 SATCOM (mainly Ku-Band, Sat-TV, Rx-only) 
6.1.10 SATCOM (mainly Ka-Band, Broadband, Tx-Rx) 
6.1.11 SATNAV 
6.1.12 VSATs (ground terminals only) 
6.1.13 Mobile WiMAX 
6.2 MMIC ASPs 
6.2.1 ASPs for GaAs PAs into Cell Phones 
6.2.2 ASPs for GaAs Switch MMICs into Cell Phones 
6.2.3 ASPs for SiGe PA MMICs into Cell Phones
6.2.4 ASPs for SiGe Switch MMICs into Cell Phones 
6.2.5 ASPs for GaAs PA MMICs for Defense Applications 
6.2.6 ASPs for GaAs non-PA MMICs into Defense Applications 
6.2.7 ASPs for GaN PA MMICs for Defense Applications 
6.2.8 ASPs for non-PA GaN MMICs for Defense Applications 
6.2.9 ASPs for SiGe PA MMICs for Defense Applications 
6.2.10 ASPs for SiGe non-PA MMICs for Defense Applications 
6.2.11 ASPs for GaAs PA MMICs into ICC Applications 
6.2.12 ASPs for MMICs into MW Radio, SATCOM and VSAT Applications 
6.2.13 ASPs for GaAs MMICs into MMW Radio Applications 
6.2.14 ASPs for GaAs and SiGe MMICs into SATNAV Applications 
6.2.15 ASPs for WiMAX (Mobile) Applications 
6.2.16 Total Aggregated TAMs (US$) 
6.3 Cell Phones 
6.3.1 Cell phone GaAs PAs 
6.3.2 Cell phone GaAs Switches 
6.3.3 Cell phone SiGe PAs 
6.3.4 Cell phone SiGe Switches 
6.3.5 Aggregated Cell Phone MMICs TAM Data 
6.4 Defense 
6.4.1 MMICs into AESAs 
6.4.1.1 GaAs MMICs into AESA PAs 
6.4.1.2 GaAs MMICs into AESA non-PAs 
6.4.1.3 Aggregated TAMs for GaAs MMICs into AESAs 
6.4.1.4 GaN MMICs into AESA PAs 
6.4.1.5 GaN non-PA MMICs into AESAs 
6.4.1.6 SiGe non-PA MMICs into AESAs
6.4.1.7 SiC MMICs into PAs for AESAs 
6.4.1.8 Aggregated MMICs into AESAs TAM Data 
6.4.2 MMICs into EW 
6.4.2.1 GaAs MMICs into EW PAs 
6.4.2.2 Non-PA GaAs MMICs into EW 
6.4.2.3 Aggregated TAMs for GaAs MMICs into EW 
6.4.2.4 GaN MMICs into EW PAs 
6.4.2.5 GaN MMICs into EW non-PAs 
6.4.2.6 Aggregated TAMs for GaN MMICs into EW 
6.4.2.7 SiGe MMICs into EW non-PAs 
6.4.2.8 TAMs for all MMIC PAs into EW 
6.4.2.9 TAMs for all MMIC non-PAs into EW 
6.4.2.10 Aggregated TAMs for all MMICs into EW 
6.4.2.11 Dedicated Defense Communications (DDC) 
6.5 Intelligent Cruise Control (ICC) 
6.5.1 24-26 GHz GaAs MMICs into ICC 
6.5.2 77-79 GHz GaAs MMICs into ICC 
6.5.3 24-26 GHz SiGe MMICs into ICC 
6.5.4 79 GHz SiGe MMICs into ICC
6.5.5 Aggregated TAMs for all MMICs into ICC 
6.6 Industrial, Scientific and Medical (ISM) 
6.6.1 TAMs for GaAs MMICs into ISM 
6.6.2 TAMs for GaN MMICs into ISM 
6.6.3 TAMs for InP MMICs into ISM 
6.6.4 TAMs for SiC MMICs into ISM 
6.6.5 TAMs for SiGe MMICs into ISM
6.6.6 Aggregated TAMs for MMICs into ISM Applications 
6.7 Microwave (MW) Radio 
6.7.1 Microwave (MW) radio – receive-side 
6.7.1.1 Microwave (MW) radio – receive-side GaAs 
6.7.1.2 Microwave (MW) radio – receive-side SiGe 
6.7.1.3 Microwave (MW) radio – transmit-side GaAs 
6.7.1.4 Microwave (MW) radio – transmit-side GaN 
6.7.2 Aggregated TAMs for MMICs into Microwave (MW) Radio Applications 
6.8 Millimeter-wave Radio 
6.8.1 GaAs MMICs into the Transmit Side of Millimeter-wave Radio Systems 
6.8.2 GaAs MMICs into PAs - Transmit Side of Millimeter-wave Radio Systems 
6.8.3 GaAs MMICs into “non-PAs” Millimeter-wave Radio Systems 
6.9 SATCOM 
6.9.1 BB SATCOM (mainly Ka-band) 
6.9.1.1 GaAs MMICs into Receive-side BB SATCOM 
6.9.1.2 SiGe MMICs into Receive-side BB SATCOM 
6.9.1.3 GaAs MMICs into Transmit-side BB SATCOM 
6.9.1.4 GaN MMICs into Transmit-side BB SATCOM 
6.9.1.5 Aggregated BB SATCOM MMIC TAMs 
6.9.2 VSATs 
6.9.2.1 GaAs MMICs into Receive-side VSAT 
6.9.2.2 SiGe MMICs into Receive-side VSAT 
6.9.2.3 GaAs MMICs into Transmit-side VSAT 
6.9.2.4 GaN MMICs into Transmit-side VSAT 
6.9.2.5 Aggregated VSAT MMIC TAMs 
6.10 SATNAV 
6.10.1 GaAs MMICs into SATNAV Receivers
6.10.2 SiGe MMICs into SATNAV Receivers 6.10.3 Aggregated SATNAV MMIC TAMs 
6.11 GaAs MMIC PAs into WiMAX (Mobile) 

Appendix A Websites for the MMIC Players 

Appendix B Glossary of Acronyms

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